Reliable IGBT Discrete Devices for Smart Grid Infrastructure

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Reliable IGBT Discrete Devices for Smart Grid Infrastructure

Customization:	Available
Application:	Power Electronic Components, Refrigerator, Solar Cell, EV, Solar Energy,
Certification:	RoHS

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Product Description

📋 Basic Information

Manufacturing Technology

Integrated Circuits Device

Material

Power Semiconductor

Model

Package

A1, A3, A4, A5, A6

Signal Processing

Digital

Refer to Infenon

Hpd, HP1, DC

Transport Package

Box

Specification

IGBT

Trademark

Origin

Made in China

🚀 Product Description

🏭 Profile & Capabilities

The enterprise was established in June 2019 and operates as a high-tech center specialized in IGBT, FRD, and SiC chips. The facility integrates design, production, application program development, and technical services for power modules.

Focus areas include new energy applications such as electric vehicles, photovoltaic systems, energy storage, wind power, and charging infrastructure, while also addressing industrial control and power quality needs.

86000m² Floor Area	200 Million Total Investment (¥)	1,000,000 Phase I Annual Capacity	5,000,000 Phase II Annual Capacity

86000m² Floor Area

200 Million Total Investment (¥)

1,000,000 Phase I Annual Capacity

5,000,000 Phase II Annual Capacity

The manufacturing philosophy emphasizes "zero-defect" products and comprehensive customer solutions, fostering independent innovation to maintain status as a leading power semiconductor manufacturer.

⚙ Technical Specifications

🎖 Quality Certifications

🤝 Global Partners

❓ Frequently Asked Questions

What are the primary applications for these IGBT modules?

Our IGBT modules are designed for new energy sectors including electric vehicles (EV), photovoltaic systems, energy storage, wind power, and industrial charging piles.

What is the total production capacity of the facility?

The manufacturing center has a planned annual capacity of 1 million power modules in Phase I, expanding to 5 million modules in Phase II.

Which semiconductor materials are utilized in your products?

We specialize in power semiconductors, specifically focusing on IGBT, FRD, and SiC (Silicon Carbide) chips.

What packaging options are available for these devices?

Standard package types include A1, A3, A4, A5, and A6, suitable for various integration requirements in power electronics.

How is the quality of the power modules ensured?

We adhere to a "zero-defect" philosophy, utilizing independent innovation and rigorous technical services to ensure high reliability across all power semiconductor products.

Are these products compatible with international standards?

Yes, our products are designed with manufacturing technologies that refer to industry benchmarks like Infineon Hpd/HP1/DC standards, ensuring global compatibility.